General Summary:
Headquartered in San Diego, for over 40 years Qualcomm’s inventions have inspired others to make the impossible, possible. From 5G to artificial intelligence, IoT to automotive and extended reality applications, Qualcomm is inventing the technologies of an intelligently connected future, spearheading research efforts for the next global wireless standard, and collaborating with industry leaders in the wireless value chain to make this future a commercial reality. You’re bringing skills. We’ll provide the environment and the experience to push your limitless potential.
You will be part of an exciting team in Central Hardware System Group working on the latest generation of QUALCOMM’s Snapdragon Products. As an HW/SW Profiling Engineer, you will be responsible for analyzing and improving the performance of both hardware and software components in the area of Electrical and Thermal stress. The electrical stress will include power delivery (PDN) and signal integrity (SIPI) related stress. The successful candidate will exhibit strong technical and interpersonal skills for interacting with Hardware and Software engineers.
Here are the key responsibilities:
1. Server-focused profiling & analysis: Instrument software changes to profile hardware behavior during post-silicon on server platforms; perform lessons learned reviews of post-silicon profile data to improve hardware design at the pre-silicon stage. Emphasize socket characteristics, DDR bandwidth/latency, PCIe/NVMe/NIC paths, and end-to-end I/O.
2. Benchmark-driven insights (server workloads): Use benchmark profiling tools and techniques to identify improvements across software and hardware, with a focus on representative server workloads (e.g., web front-end, etc).
3. Electrical/thermal co-optimization for data centers: Collaborate with software engineers, hardware engineers, and system architects to optimize code and designs; propose and implement changes that improve electrical and thermal performance of the system under rack-level airflow, inlet temperature, and PDN constraints typical of data-center environments.
4. Benchmarking & testing (SIPI/PDN/Thermal): Develop and execute benchmark tests to evaluate the SIPI, PDN, and thermal system under varied server workloads and duty cycles; compare performance against industry standards and competitors (e.g., throughput, latency, tail latencies, perf/W, and thermal headroom).
5. Use-case investigation & pre-enablement gates (Server): Investigate and study server use cases before enabling features—reproduce end-to-end scenarios, validate stability and performance at scale, define enablement criteria and rollback plans, and sequence rollout to protect production images.
6. Tools & automation for scale: Develop and maintain profiling tools and automation scripts to run at rack/fleet scale, enabling repeatable measurement, remote orchestration, telemetry collection (perf, power, thermals, errors), and regression detection
7. Interdisciplinary collaboration: Collaborate with software development teams to provide guidance on performance best practices for server targets; work closely with hardware design teams to optimize designs based on profiling insights.
8. Reporting & communication: Create dashboards and reports to visualize profiling data; document profiling methodologies, findings, and recommendations; and present results to key stakeholders—including management and engineering teams—with server-centric KPIs (throughput, latency/tail, perf/W, thermal limits, and reliability signals).
Minimum Qualifications:
• Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 8+ years of Software Applications Engineering, Software Development experience, or related work experience.Preferred Qualifications:
· Bachelor’s or Master’s degree in Computer Science, Computer Engineering, Electrical Engineering, or related field and 15+ years of related work experience
· Strong understanding of embedded system, SIPI, PDN and Thermal
· Proficiency in profiling tools and system analysis
· Experience with programming languages (C/C++, Python, etc) and low-level system programming
· Strong knowledge of hardware design principles and software optimization techniques
· Excellent problem-solving skills and attention to details
· Strong interpersonal skills to interact with Software and Hardware Engineers
· Understanding of Server SW use cases and implications to HW is a plus.
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
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Pay range and Other Compensation & Benefits:
$192,000.00 - $288,000.00The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.